Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2010-10-06
2011-11-15
Nguyen, Ha Tran T (Department: 2829)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
C438S112000, C257S787000, C257SE23126, C257SE33059
Reexamination Certificate
active
08058109
ABSTRACT:
The present invention provides a method for manufacturing a semiconductor structure, —including—the following steps of: forming a substrate having a package array; forming a thermosetting non-conductive layer covering the substrate; partially solidifying the thermosetting non-conductive layer to form a semi-solid non-conductive layer; connecting chips to the package array on the substrate; pressing and heating the chips and the substrate so that the semi-solid non-conductive layer adheres with the chips and the substrate; pre-heating an encapsulant preformed on a metal layer; covering the chips on the substrate with the encapsulant; and solidifying the encapsulant to completely cover the chips on the substrate. The present invention can reduce use of gold to lower the manufacturing cost and can also improve the heat conduction efficiency of the semiconductor structure to enhance operational stability of the chips.
REFERENCES:
patent: 6774026 (2004-08-01), Wang et al.
patent: 2003/0151140 (2003-08-01), Nishiyama et al.
patent: 2009/0260229 (2009-10-01), Motomura et al.
Cantor & Colburn LLP
Chipmos Technologies Inc.
Nguyen Ha Tran T
Scarlett Shaka
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