4. Active solid-state devices (e.g., transistors, solid-state diode
  5. With shielding

Chih-Pin Hung

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active

Bridge connection type of chip package and fabricating...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Bridge connection type of chip package and fabricating...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Carrier with embedded component and method for fabricating...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Circuit substrate and fabrication method thereof

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Amorphous semiconductor
Reexamination Certificate

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Flip chip package structure and flip chip device with area bump

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2182994

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