Circuit substrate and fabrication method thereof

Details Circuit substrate and fabrication method thereof Circuit substrate and fabrication method thereof

2006-06-13

2006-06-13

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Formation of semiconductive active region on any substrate

Amorphous semiconductor

C438S108000, C438S667000

Reexamination Certificate

active

07060595

ABSTRACT:
A circuit substrate includes a board, a plurality of metal layers and an insulator. The board has a plurality of conductive traces layers and a via formed therein. The metal layers are formed on the inner wall of the via and each of the metal layers is electrically connected to its corresponding conductive traces layer. The via is filled with the insulator so that each of the metal layers is electrically isolated from each other. In addition, this invention also provides a fabrication method of the circuit substrate.

REFERENCES:
patent: 6406939 (2002-06-01), Lin
patent: 6600214 (2003-07-01), Ishikawa et al.
patent: 6618940 (2003-09-01), Lubert et al.

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