Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-08-16
2011-08-16
Datskovskiy, Michael V (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S760000, C361S764000, C257S668000, C257S673000, C257S675000, C174S250000, C174S260000, C174S265000
Reexamination Certificate
active
08000107
ABSTRACT:
A carrier with embedded components comprises a substrate and at least one embedded component. The substrate has at least one slot and a first composite layer. The embedded component is disposed at the slot of the substrate. The first composite layer has a degassing structure, at least one first through hole and at least one first fastener, wherein the degassing structure corresponds to the slot, the first through hole exposes the embedded component, and the first fastener is formed at the first through hole and contacts the embedded component. According to the present invention, the degassing structure can smoothly discharge the hydrosphere existing within the carrier under high temperature circumstances and the first fastener is in contact with the embedded component, which increases the joint strength between the embedded component and the substrate.
REFERENCES:
patent: 6194778 (2001-02-01), Ohsawa et al.
Hung Chih-Pin
Ou In-De
Wang Yung-Hui
Advanced Semiconductor Engineering Inc.
Datskovskiy Michael V
Muncy Geissler Olds & Lowe, PLLC
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