4. Special receptacle or package
  5. Holder for a removable electrical component
  6. For a semiconductor wafer

Chih-Ching Lin

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Al-Cu alloy sputtering method with post-metal quench

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Fabrication method for a damascene bit line contact plug

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate

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Integrated circuit wafer and retainer element combination

Special receptacle or package – For a building component – Shingle
Patent

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Interconnect structure and method for fabricating the same

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Interconnect structure and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1385219

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