Electrical audio signal processing systems and devices
Electro-acoustic audio transducer
Having protective or sheilding feature
Inventor
active
Microelectromechanical microphone packaging system
Multi-chips bumpless assembly package and manufacturing...
Multi-chips module package and manufacturing method thereof
Packaging substrate and manufacturing method thereof
Thermal enhance MCM package and manufacturing method thereof
No associations
LandOfFree
Chian-Chi Lin does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Chian-Chi Lin, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chian-Chi Lin will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-2188888