Thermal enhance MCM package and manufacturing method thereof

Details Thermal enhance MCM package and manufacturing method thereof Thermal enhance MCM package and manufacturing method thereof

2006-02-21

2006-02-21

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S707000, C361S719000, C361S721000, C257S706000, C257S707000

Reexamination Certificate

active

07002805

ABSTRACT:
A thermal enhance multi-chips module (MCM) package mainly comprises a first package, a first carrier, a second package, a second carrier, an intermediate substrate and a cap-like heat spreader. The intermediate substrate has an opening. The first carrier and the second carrier are electrically connected to the first package and the second package respectively. The second package is accommodated in the opening and electrically connected to the first package via the first carrier, the second carrier and the intermediate carrier. The cap-like heat spreader has a supporting portion and an alignment portion wherein the supporting portion is connected to the alignment portion to define a cavity. The cavity not only accommodates the first package, the first carrier, the second package, the second carrier and the intermediate substrate but also provides alignment mechanism by the supporting portion and the alignment portion to prevent the dislocation after all the components of the thermal enhance MCM package are connected with each other. Furthermore, the first carrier has a first side and the second carrier has a second side. The first side and the second side both have grounding portions, for example recessed portions and metal layers, for providing a ground shielding of the first package and the second package against the outside. In addition, the grounding portions also provide thermal paths to increase the ability of the heat dissipation. Besides, a method for manufacturing the thermal enhance MCM package is provided.

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