Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2007-05-22
2007-05-22
Weiss, Howard (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S778000
Reexamination Certificate
active
10900089
ABSTRACT:
A multi-chips module package comprises a lead frame, a first chip, a second chip, a plurality of electrically conductive wires and an encapsulation. The lead frame has a plurality of first leads, second leads and chip pads connecting to the first leads. The first chip is placed on the lead frame and electrically connected to the lead frame through the bumps connecting the bump-bonding pads and the chip pads and the first leads; the second chip is placed over the first chip and electrically connected to the lead frame through the wires connecting the wire-bonding pads to the second leads; and the encapsulation covers the first chip, the second chip, the lead frame, and the wires. In such a manner, it not only reduces the distance of transmitting the electrical signals from chips to the outside but also it can save cost due to the lead frame manufactured by a simple manufacturing processes. In addition, a manufacturing method of the multi-chips module package is provided.
REFERENCES:
patent: 6858920 (2005-02-01), Hatauchi
patent: 11219984 (1999-10-01), None
patent: 523887 (2003-03-01), None
Chang Chih-Huang
Lin Chian-Chi
Advanced Semiconductor Engineering Inc.
Bacon & Thomas PLLC
Trinh (Vikki) Hoa B.
Weiss Howard
LandOfFree
Multi-chips module package and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multi-chips module package and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-chips module package and manufacturing method thereof will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3820747