Electrical audio signal processing systems and devices – Electro-acoustic audio transducer – Having protective or sheilding feature
Reexamination Certificate
2011-05-17
2011-05-17
Le, Lana N (Department: 2614)
Electrical audio signal processing systems and devices
Electro-acoustic audio transducer
Having protective or sheilding feature
C381S175000, C381S355000, C381S369000, C257S678000, C257S787000
Reexamination Certificate
active
07945062
ABSTRACT:
The invention relates to a microelectromechanical microphone packaging system. The microelectromechanical microphone packaging system comprises a substrate, a chip, a microelectromechanical microphone, a conductive glue, a non-conductive glue and a cover. The substrate has a first surface. The chip is mounted on the first surface of the substrate. The microelectromechanical microphone is mounted on the first surface of the substrate, and electrically connected to the chip. The chip is enclosed by the non-conductive glue. The non-conductive glue is enclosed by the conductive glue. The cover is mounted on the first surface of the substrate to form a containing space, and has an acoustic aperture. The microelectromechanical microphone packaging system utilizes the conductive glue enclosing the chip and the non-conductive glue to shield interference from outside noise and obtain a shielding effect. In addition, the cover does not need to be made of metal material.
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Lin Chian-Chi
Wang Wei-Chung
Wu Sung-Mao
Yang Hsueh-An
Yang Kuo-Pin
Advanced Semiconductor Engineering Inc.
Eason Matthew
Le Lana N
Volentine & Whitt P.L.L.C.
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