4. Cleaning and liquid contact with solids
  5. Processes
  6. Including application of electrical radiant or wave energy...

Chia-Hung Lai

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Bond pad scheme for Cu process

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Bond pad scheme for Cu process

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Laminated silicate glass layer etch stop method for...

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate

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Method for manufacturing dual damascene structure with a...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method of stripping photoresist from Al bonding pads that preven

Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...
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Profile ID: LFUS-PAI-P-1981144

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