Laminated silicate glass layer etch stop method for...

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Reexamination Certificate

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C438S723000, C438S745000

Reexamination Certificate

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10278968

ABSTRACT:
A method for fabricating a microelectronic fabrication employs an undoped silicate glass layer as an etch stop layer when etching a doped silicate glass layer with an anhydrous hydrofluoric acid etchant. The method is particularly useful for forming a patterned salicide blocking dielectric layer when fabricating a complementary metal oxide semiconductor device.

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Hawley's Condensed Chenical Dictionary, Richard J. Lewis, Sr., Thirteenth edition, p. 589.
S. Wolf “Silicon Processing for the VLSI Era”, vol. 1. 1986, pp. 532-533.

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