4. Organic compounds -- part of the class 532-570 series
  5. Organic compounds
  6. Oxygen containing

Chia-Chung Wang

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Built-in stress pattern on IC dies and method of forming

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...
Reexamination Certificate

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Method for forming solder bumps for flip-chip bonding by...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method of making a semiconductor chip assembly with a metal...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Method of making a semiconductor chip assembly with a...

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal
Reexamination Certificate

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Method of making a semiconductor chip assembly with a...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Profile ID: LFUS-PAI-P-652044

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