Method of making a semiconductor chip assembly with a metal...

Details Method of making a semiconductor chip assembly with a metal... Method of making a semiconductor chip assembly with a metal...

2005-08-31

2008-09-02

Hoang, Quoc D (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S612000, C257SE21503

Reexamination Certificate

active

07419851

ABSTRACT:
A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a metal containment wall and a solder layer in which the metal containment wall includes a cavity and the solder terminal contacts the metal containment wall in the cavity, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects the routing line and the pad, etching the metal base to reduce contact area between the metal base and the routing line and between the metal base and the metal containment wall, and providing a solder terminal that includes the solder layer.

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