Method of making a semiconductor chip assembly with a...

Details Method of making a semiconductor chip assembly with a... Method of making a semiconductor chip assembly with a...

2009-11-30

2011-10-11

Lindsay, Jr., Walter L (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S122000

Reexamination Certificate

active

08034645

ABSTRACT:
A method of making a semiconductor chip assembly includes providing a post and a base that include a copper surface layer and an aluminum core, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

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