4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Insulating material

Chi-Jung Song

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Area array type semiconductor package and fabrication method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Area array type semiconductor package fabrication method

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Encapsulation method for ball grid array semiconductor package

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Method for fabricating an image sensor mounted by mass reflow

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate

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Package body and semiconductor chip package using same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Profile ID: LFUS-PAI-P-905906

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