Area array type semiconductor package fabrication method

Details Area array type semiconductor package fabrication method Area array type semiconductor package fabrication method

2006-10-17

2006-10-17

Zarabian, Amir (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S106000, C438S111000, C438S112000, C438S118000, C438S119000, C438S123000, C438S124000, C438S125000, C438S126000, C438S127000, C438S613000, C257S667000, C257S668000, C257S669000, C257S670000, C257S671000, C257S673000, C257S674000, C257S676000, C257S773000, C257S778000, C257S787000

Reexamination Certificate

active

07122401

ABSTRACT:
An area array type semiconductor package includes a plurality of conductive media such as solder bumps or solder balls, attached to respective bond pads of a chip. The conductive media act as external output terminals. The chip is attached to a lead frame by a thermal conductive adhesive, and a predetermined area of the lead frame and the semiconductor chip are packaged with a molding resin. Leads of the lead frame are then trimmed and formed so that the lead frame, to which the semiconductor chip is adhered, acts as a heat sink. This allows the package to be used for a high-powered semiconductor device which radiates a high temperature heat. Also, because conductive media such as solder bumps or solder balls can be used to directly connect bond pads of the chip to conductive regions of a circuit board, a size of the semiconductor package can be minimized, the arrangement of the bonding pads on the chip can be easily planned, and electrical characteristics of the semiconductor package can be improved.

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