4. Semiconductor device manufacturing: process
  5. Coating of substrate containing semiconductor region or of...
  6. Insulative material deposited upon semiconductive substrate

Cheng-Yuan Tsai

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Bilayer silicon carbide based barrier

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Forming copper interconnects in dielectric materials with...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Interconnect structure with polygon cell structures

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means
Reexamination Certificate

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Low-K dual damascene integration process

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method for enhancing FSG film stability

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1055785

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