4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. Insulated gate formation

Cheng-Yu Chu

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Alignment dip back oxide and code implant through poly to...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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Bump reflow method by inert gas plasma

Metal fusion bonding – Process – Plural joints
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Bumping process to increase bump height and to create a more...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
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Colors only process to reduce package yield loss

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
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Colors only process to reduce package yield loss

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
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Profile ID: LFUS-PAI-P-2008786

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