Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2002-04-18
2004-03-30
Stoner, Kiley (Department: 1725)
Metal fusion bonding
Process
Plural joints
C228S205000, C228S219000, C228S220000, C438S613000
Reexamination Certificate
active
06712260
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates generally to semiconductor fabrication and more specifically to processes of reflowing bumps.
BACKGROUND OF THE INVENTION
Current bump reflow methods requires many machines such as flux coaters, reflow furnaces flux cleaners to do bump flux reflow. A flux chemical is required which is a pollution source. The reflowed bump height is low with a large diameter.
U.S. Pat. No. 6,179,200 B1 to Kung et al. describes a solder bump process.
U.S. Pat. No. 6,121,062 to Karasawa et al. describes another molder bump process.
U.S. Pat. No. 6,114,187 to Hayes describes a solder reflow process.
U.S. Pat. No. 5,125,560 to Degani et al. describes a solder reflow process using a flux.
SUMMARY OF THE INVENTION
Accordingly, it is an object of one or more embodiments of the present invention to provide an improved method of reflowing bumps.
Other objects will appear hereinafter.
It has now been discovered that the above and other objects of the present invention may be accomplished in the following manner. Specifically, a wafer is provided. A series of spaced initial bumps is formed upon the wafer. The initial bumps having exposed side walls and top surfaces and organic residue over the initial bump side walls and/or the initial bump top surfaces. The organic residue is simultaneously removed from the initial bump side walls and top surfaces with the forming a surface oxide layer over the initial bump side walls and top surfaces. The surface oxide layer is stripped from the initial bump top surfaces and an upper portion of the initial bump side walls to form partially exposed bumps. The partially exposed bumps are heat treated to melt the partially exposed bumps to form the reflowed bumps.
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Chu Cheng-Yu
Kuo Wen-Chang
Lin Chia-Fu
Pan Sheng-Liang
Wang Szu-Yao
Stanton Stephen G.
Stoner Kiley
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