Bumping process to increase bump height and to create a more...

Details Bumping process to increase bump height and to create a more... Bumping process to increase bump height and to create a more...

2005-10-18

2005-10-18

Trinh, Michael (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C438S737000, C438S738000, C438S779000

Reexamination Certificate

active

06956292

ABSTRACT:
A new process is provided which is an extension and improvement of present processing for the creation of a solder bump. After the layers of Under Bump Metal and a layer of solder metal have been created in patterned and etched format and overlying the contact pad, following a conventional processing sequence, a layer of polyimide is deposited. The solder flow is performed using the thickness of the deposited layer of polyimide to control the height of the column underneath the reflown solder.

REFERENCES:
patent: 5329423 (1994-07-01), Scholz
patent: 5597737 (1997-01-01), Greer et al.
patent: 5903058 (1999-05-01), Akram
patent: 5904156 (1999-05-01), Advocate, Jr. et al.
patent: 5914274 (1999-06-01), Yamaguchi et al.
patent: 6211052 (2001-04-01), Farnworth
patent: 6451681 (2002-09-01), Greer
patent: 6528881 (2003-03-01), Tsuboi
patent: 6620720 (2003-09-01), Moyer et al.

Affiliated with

Also associated with

Rating

Bumping process to increase bump height and to create a more... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bumping process to increase bump height and to create a more..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bumping process to increase bump height and to create a more... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3470257