Colors only process to reduce package yield loss

Details Colors only process to reduce package yield loss Colors only process to reduce package yield loss

2008-12-31

2010-10-19

Nhu, David (Department: 2895)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S075000, C438S144000, C257SE21185, C257SE21617, C257SE21632, C257SE27134, C257SE27159, C257SE27155

Reexamination Certificate

active

07816169

ABSTRACT:
Disclosed is an ordered microelectronic fabrication sequence in which color filters are formed by conformal deposition directly onto a photodetector array of a CCD, CID, or CMOS imaging device to create a concave-up pixel surface, and, overlayed with a high transmittance planarizing film of specified index of refraction and physical properties which optimize light collection to the photodiode without additional conventional microlenses. The optically flat top surface serves to encapsulate and protect the imager from chemical and thermal cleaning treatment damage, minimizes topographical underlayer variations which would aberrate or cause reflection losses of images formed on non-planar surfaces, and, obviates residual particle inclusions induced during dicing and packaging. A CCD imager is formed by photolithographically patterning a planar-array of photodiodes on a semiconductor substrate. The photodiode array is provided with metal photoshields, passivated, and, color filters are formed thereon. A transparent encapsulant is deposited to planarize the color filter layer and completes the solid-state color image-forming device without conventional convex microlenses.

REFERENCES:
patent: 4870268 (1989-09-01), Vincent et al.
patent: 5371397 (1994-12-01), Maegawa et al.
patent: 5595930 (1997-01-01), Back
patent: 5672519 (1997-09-01), Song et al.
patent: 5691548 (1997-11-01), Akio
patent: 5693967 (1997-12-01), Park et al.
patent: 5796154 (1998-08-01), Sano et al.
patent: 5844290 (1998-12-01), Furumiya
patent: 5976907 (1999-11-01), Shigeta et al.
patent: 6040591 (2000-03-01), Otsuka
patent: 6091093 (2000-07-01), Kang et al.
patent: 6171883 (2001-01-01), Fan et al.
patent: 6171885 (2001-01-01), Fan et al.
patent: 6482669 (2002-11-01), Fan et al.
patent: 6682659 (2004-01-01), Cho et al.
patent: 6876049 (2005-04-01), Fan et al.
patent: 7183598 (2007-02-01), Fan et al.
patent: 7485906 (2009-02-01), Fan et al.

Affiliated with

Also associated with

Rating

Colors only process to reduce package yield loss does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Colors only process to reduce package yield loss, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Colors only process to reduce package yield loss will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4180936