Chender Huang

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Anti-bow zip lead frame design

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Apparatus and method for manufacturing a semiconductor wafer...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Apparatus and method for manufacturing a semiconductor wafer...

Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks
Reexamination Certificate

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Buildup substrate pad pre-solder bump manufacturing

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Discrete die burn-in for non-packaged die

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor
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Profile ID: LFUS-PAI-P-1216502

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