1991-04-24
1992-09-22
Hille, Rolf
H01L 2348, H01L 2312
Patent
active
051501945
ABSTRACT:
A new and improved integrated circuit lead frame to be used to reduce bowing during the assembly of conventional microcircuits is described, wherein a conventional die attach paddle is supported on one side by at least one tie bar, extending conventionally between the paddle and the lead finger support structure also known as dam bars, and supported on the opposing side by a plurality of tie bars which are attached on their opposing ends to a novel support beam. This support beam extends between opposing side of the lead frame and provides independent support for the tie bars on the one side and permits dimensional and angular symmetry, similarity and parity to be achieved in the location of all of the tie bars in order to optimize the stability and integrity of the die pad and reduce bowing after the encapsulation process.
REFERENCES:
patent: 4482915 (1984-11-01), Nishikawa et al.
patent: 4801997 (1989-01-01), Ono et al.
patent: 4942454 (1990-07-01), Mori et al.
patent: 4984062 (1991-01-01), Uemura et al.
Brooks Jerry M.
Huang Chender
Clark S. V.
Duffy Wayne E.
Hille Rolf
Micro)n Technology, Inc.
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