Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-11-01
2005-11-01
Thompson, Craig A. (Department: 2813)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
Reexamination Certificate
active
06960518
ABSTRACT:
A new method is provided for the interconnection of flip chips to a supporting substrate. The invention starts with a conventional first substrate, that serves as a semiconductor device support structure, over the surface of which a first pattern of contacts points has been provided. The invention then uses a second substrate, for instance a glass or quartz plate, and creates over the surface thereof a second pattern of solder bumps separated by solder non-wettable surfaces. The second pattern is a mirror image of the first pattern. By then overlying the first pattern of contact points with the second pattern of solder bumps, a step of reflow can be applied to the solder bumps, transferring the solder bumps from the second substrate to the contact points provided over the first substrate.
REFERENCES:
patent: 5492266 (1996-02-01), Hoebener et al.
patent: 5646068 (1997-07-01), Wilson et al.
patent: 6136047 (2000-10-01), Karasawa et al.
patent: 6288376 (2001-09-01), Tsumura
patent: 6289803 (2001-09-01), Ball
patent: 6293456 (2001-09-01), MacKay et al.
patent: 6295730 (2001-10-01), Akram
patent: 6300250 (2001-10-01), Tsai
patent: 6409073 (2002-06-01), Kaskoun et al.
patent: 6432807 (2002-08-01), Tsukui et al.
patent: 6518093 (2003-02-01), Nakamikawa
Chen Ken
Huang Chender
Huang Hank
Tsao Pei-Haw
Wang Jones
Dolan Jennifer M
Taiwan Semiconductor Manufacturing Co. Ltd.
Thomas Kayden Horstemeyer & Risley
Thompson Craig A.
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