4. Wave transmission lines and networks
  5. Coupling networks
  6. Nonreciprocal gyromagnetic type

Charles D. Rosier

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Integrated circuit package for flip chip with alignment preform

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Patent

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Integrated circuit package for flip chip with alignment...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Microwave transistor stabilization circuit

Wave transmission lines and networks – Coupling networks – Nonreciprocal gyromagnetic type
Patent

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Monolithic FET bridge attenuator

Wave transmission lines and networks – Attenuators
Patent

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Phase-compensated FET attenuator

Wave transmission lines and networks – Attenuators
Patent

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Profile ID: LFUS-PAI-P-362017

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