Integrated circuit package for flip chip with alignment preform

Details Integrated circuit package for flip chip with alignment preform Integrated circuit package for flip chip with alignment preform

1998-04-13

2000-03-21

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

201782, 201780, H01L 2348, H01L 2352, H01L 2940

Patent

active

060406305

ABSTRACT:
An integrated circuit package includes a substrate having a circuitry pattern formed on the substrate. A thermoplastic attachment film is positioned on the substrate and has vias that expose the circuitry pattern. A flip chip has input/output contacts formed as conductive bumps and mounted on the thermoplastic attachment film such that the conductive bumps are received within the cut openings and engage the circuitry pattern. The thermoplastic attachment film forms an underfill and a thermoplastic bond between the substrate and the flip chip, which allows ready removal of the flip chip upon application of heat. A method is also disclosed forming the integrated circuit package using the flip chip, thermoplastic attachment film and substrate of the present invention.

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