4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Making plural separate devices

Charan Gurumurthy

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Assembly of thin die coreless package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Forming a helical inductor

Inductor devices – Coil or coil turn supports or spacers – Printed circuit-type coil
Reexamination Certificate

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Integrated circuit and process for fabricating thereof

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method of forming collapse chip connection bumps on a...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Method of using micro-contact imprinted features for...

Metal working – Method of mechanical manufacture – Electrical device making
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Profile ID: LFUS-PAI-P-2216898

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