Method of using micro-contact imprinted features for...

Details Method of using micro-contact imprinted features for... Method of using micro-contact imprinted features for...

2006-03-21

2006-03-21

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S846000, C438S443000, C438S618000, C438S637000

Reexamination Certificate

active

07013562

ABSTRACT:
An imprinting stamp to imprint an opening in a material layer in which the imprint stamp has a coating of a seed material. The seed material is transferred onto the surface within the opening to operate as a seed for filling the opening. In one embodiment, low surface energy material is used as a passivation layer between the imprinting surface and the seed coating to reduce adhesion during micro-contact transfer of the seed into the opening. The imprinting stamp is used to form trenches and via openings for formation of electrical interconnects.

REFERENCES:
patent: 6599824 (2003-07-01), Krivokapic
patent: 6623803 (2003-09-01), Krivokapic
patent: 6849558 (2005-02-01), Schaper
patent: 6866764 (2005-03-01), Dalman et al.
patent: 2004/0183236 (2004-09-01), Ogino et al.

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