4. Stock material or miscellaneous articles
  5. All metal or with adjacent metals
  6. Composite; i.e., plural, adjacent, spatially distinct metal...

Chandrasekhar Narayan

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Apparatus for activating fusible links on a circuit substrate

Refrigeration – Storage of solidified or liquified gas – Including cryostat
Reexamination Certificate

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Chip and wafer integration process using vertical connections

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Chip and wafer integration process using vertical connections

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Conductor-insulator-conductor structure

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
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Controlled temperature bonding

Metal fusion bonding – Process – With protecting of work or filler or applying flux
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Profile ID: LFUS-PAI-P-126878

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