Controlled temperature bonding

Metal fusion bonding – Process – With protecting of work or filler or applying flux

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228 62, 228 59, 228214, 228232, B23K 3102, B23K 3700

Patent

active

056411146

ABSTRACT:
In a bonding station the parts of the apparatus to be bonded are retained at a thermal bias temperature at a permitted level and a thermal check valve interface is provided between the bonding location and the part of the station that would serve as a conduction heat sink, thereby thermally insulating other uninvolved parts of the structure and and confining the bonding heat to the bonding region. Such confinement reduces the dwell time that the bond must remain at the bonding temperature. The bonding station has a number of features: the parts to be bonded are maintained on a support member that is provided with a heat biasing capability that can establish the assembly at a specified temperature; a retention capability, such as the use of vacuum, is provided to maintain registration and thermal contact of the part with the support; and a thermal check valve capability is provided to control the rate of heat flow through the support member so that locallized heat is controlled in dissipation.

REFERENCES:
patent: 4972988 (1990-11-01), Ohdate
patent: 5478008 (1995-12-01), Takahashi
O'Mara, W.C., "Active Matrix Liquid Crystal Displays--Part 1: Manufacturing Process", Solid State Technology, Dec. 1991, pp. 65-70.
Plach, et al., "Liquid Crystals for Active Matrix Displays", Solid State Technology, Jun. 1992, pp. 186-193.

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