4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Assembly of plural semiconductive substrates each possessing...

Chan Min Yu

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Apparatus and method for packaging circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
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In-process semiconductor packages with leadframe grid arrays

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Method for fabricating packaged die

Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure
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Method for fabricating packaged die

Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure
Reexamination Certificate

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Methods for making semiconductor packages with leadframe...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Profile ID: LFUS-PAI-P-513754

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