4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Flip chip

Carlos Juan Sambucetti

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active

Chip to wiring interface with single metal alloy layer...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Cobalt-tin alloys and their applications for devices, chip inter

Compositions: coating or plastic – Coating or plastic compositions – Metal-depositing composition or substrate-sensitizing...
Patent

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Direct chip attach for low alpha emission interconnect system

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent

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Electrode modification using an unzippable polymer paste

Stock material or miscellaneous articles – All metal or with adjacent metals – Having metal particles
Reexamination Certificate

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Electrode modification using an unzippable polymer paste

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-365559

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