Direct chip attach for low alpha emission interconnect system

Details Direct chip attach for low alpha emission interconnect system Direct chip attach for low alpha emission interconnect system

1997-05-28

1999-04-27

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438613, H01L 2144

Patent

active

058973362

ABSTRACT:
An interconnect system that has low alpha particle emission characteristics for use in an electronic device includes a semiconductor chip that has an upper surface and spaced apart electrically resistive bumps positioned on conductive regions of the upper surface, the electrically resistive bumps are made of a composite material of a polymer and metal particles, and a substrate that has conductive regions bonded to the electrically resistive bumps in a bonding process wherein the electrically resistive bumps convert to electrically conductive bumps after the bonding process.

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patent: 5468995 (1995-11-01), Higgins, III
patent: 5508228 (1996-04-01), Nolan et al.
patent: 5508561 (1996-04-01), Tago et al.

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