Electrode modification using an unzippable polymer paste

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...

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524440, 252512, C08K 308, H01B 122

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active

060137134

ABSTRACT:
A paste is described for capping electrodes with an oxide free metal layer incorporating a solvent, an unzippable polymer and particles. The electrode could be an interconnect such as a C4 bump. A method for forming a coating and for testing integrated circuit chips is also described. The invention overcomes the problem of interconnecting Pb containing electrodes that are covered with an insulating oxide on integrated circuit chips by coating the Pb containing electrode with Au to provide an oxide free surface for testing and interconnection.

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patent: 5314709 (1994-05-01), Doany et al.
patent: 5561622 (1996-10-01), Bertin et al.
patent: 5683529 (1997-11-01), Makihara et al.

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