Cobalt-tin alloys and their applications for devices, chip inter

Details Cobalt-tin alloys and their applications for devices, chip inter Cobalt-tin alloys and their applications for devices, chip inter

1995-08-24

1998-05-26

Klemanski, Helene

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 125, 427437, 4274431, C23C 1836, C23C 1850

Patent

active

057558590

ABSTRACT:
A process for electrolessly depositing cobalt-tin alloys with adjustable tin contents from 1 to over 25 atomic percent tin is disclosed. The deposited alloy is useful in the electronics and computer industries for device, chip interconnection and packaging applications. When used for chip interconnection applications, for example, the invention replaces the currently used complicated ball-limiting-metallurgy. The invention may also be used to inhibit hillock formation and electromigration in copper wire structures found in computers and micron dimension electronic devices.

REFERENCES:
patent: 3915717 (1975-10-01), Feldstein et al.
patent: 3930896 (1976-01-01), Takahama et al.
patent: 4078096 (1978-03-01), Redmond et al.
patent: 4632857 (1986-12-01), Mallory, Jr.
patent: 5203911 (1993-04-01), Sricharoenchaikit et al.

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