Method for fabricating semiconductor packages, and leadframe...

Details Method for fabricating semiconductor packages, and leadframe... Method for fabricating semiconductor packages, and leadframe...

2005-02-22

2005-02-22

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S106000, C438S111000, C438S113000, C438S123000, C438S124000, C438S126000, C438S127000

Reexamination Certificate

active

06858470

ABSTRACT:
A method for fabricating semiconductor packages provides a leadframe for packages that are to be singulated with respective predetermined package body sizes. Individual mold caps are formed on the leadframe with mold cap dimensions that are larger than the respective predetermined package body sizes. The mold caps and leadframe are sawed to singulate packages therefrom. The sawing reduces the dimensions of the mold caps to the respective predetermined package body sizes.

REFERENCES:
patent: 6333564 (2001-12-01), Katoh et al.
patent: 6608366 (2003-08-01), Fogelson et al.

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