Integrated circuit package system with down-set die pad and...

Details Integrated circuit package system with down-set die pad and... Integrated circuit package system with down-set die pad and...

2006-08-03

2010-11-16

Chambliss, Alonzo (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257S623000, C257S676000, C257S782000, C257SE21506, C257SE23031, C257SE23043, C257SE23045, C361S774000, C361S813000

Reexamination Certificate

active

07833840

ABSTRACT:
An integrated circuit package system and method of manufacture therefor includes providing a substrate with a beveled cavity, attaching a down-set conductive die pad with tapered sidewalls for matching with the beveled cavity in the substrate and having the down-set below a lower surface of the substrate, and attaching an integrated circuit over the down-set conductive die pad and electrically connected thereto.

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