4. Abrading
  5. Machine
  6. Rotary reciprocating tool

Byoung-hun Lee

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Apparatus and methods for wafer debonding using a liquid jet

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent

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Apparatus and methods for wafer debonding using a liquid jet

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent

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Chemical mechanical polishing (CMP) apparatus and CMP method usi

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Patent

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SOI substrate manufacturing method

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
Patent

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Wafer polishing device

Abrading – Machine – Rotary reciprocating tool
Patent

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Profile ID: LFUS-PAI-P-21041

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