Apparatus and methods for wafer debonding using a liquid jet

Details Apparatus and methods for wafer debonding using a liquid jet Apparatus and methods for wafer debonding using a liquid jet

1998-04-28

1999-01-26

Osele, Mark A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156584, 29239, 294263, 294265, 134 59, 134137, 134902, B32B 3500

Patent

active

058633758

ABSTRACT:
Wafer debonding of a bonded bulk wafer and a device wafer using a liquid jet to avoid scratching of the wafers is provided. The wafer debonder includes a wafer loader having a first stand with a flat upper surface and a second stand located above the first stand having a lower surface slanted with respect to the upper surface of the first stand at a predetermined angle. A first holder is connected to the first stand and a second holder is located on an imaginary surface extended from the lower surface of the second stand for holding the wafers. A liquid jetting nozzle is positioned adjacent the wafer loader to direct a jet of liquid at the interface between the wafers to separate the wafers.

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