4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Multiple housings

Byeong-Duck Lee

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Semiconductor chip package having clip-type outlead and fabricat

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Semiconductor chip package having clip-type outlead and...

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Stacked bottom lead package in semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Stacked bottom lead package in semiconductor devices and fabrica

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Profile ID: LFUS-PAI-P-524243

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