Semiconductor chip package having clip-type outlead and fabricat

Details Semiconductor chip package having clip-type outlead and fabricat Semiconductor chip package having clip-type outlead and fabricat

1996-12-05

1998-10-13

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257692, 257723, 257796, H01L 2302

Patent

active

058216154

ABSTRACT:
A semiconductor chip package having a clip type lead frame and fabrication thereof. The package includes a semiconductor chip having a plurality of bond pads thereon, a first package body having a recess, a plurality of inner leads each connected electrically to a corresponding one of the bond pads, a plurality of outleads each extended from a corresponding one of the inner leads for covering along sides of the first package body, and a second package body which covers the semiconductor chip, a plurality of metallic wires and the inner leads. The fabrication method includes the steps of forming a first package body having a recess therein, attaching to the first package body a plurality of inner leads and outleads extended from the inner leads thus to be coveringly exposed on sides of the first package body, attaching in the recess a semiconductor chip having a plurality of bond pads thereon, wire-bonding for electrically connecting each of the inner leads by a metallic wire to a corresponding one of the bond pads provided on the semiconductor chip, and forming a second package body for covering the semiconductor chip, the inner leads and the metallic wires.

REFERENCES:
patent: 4079511 (1978-03-01), Grabbe
patent: 5554886 (1996-09-01), Song

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