4. Coating processes
  5. Direct application of electrical, magnetic, wave, or...
  6. Pretreatment of substrate or post-treatment of coated substrate

Bruce A. Myers

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Chip cooling system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Circuit board with localized stiffener for enhanced circuit...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Corrosive resistant flip chip thermal management structure

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Electrical connector having energy-formed solder stops and metho

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent

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Electrical connector having energy-formed solder stops and metho

Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate
Patent

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Profile ID: LFUS-PAI-P-145295

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