Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate
Patent
1993-02-05
1994-08-02
Padgett, Marianne
Coating processes
Direct application of electrical, magnetic, wave, or...
Pretreatment of substrate or post-treatment of coated substrate
427555, 427556, 427557, 427559, 427 96, B05D 306, B05D 512
Patent
active
053344227
ABSTRACT:
A method of forming solder stops on a thick film, comprising a conductive metal and an inorganic oxide, including the step of directing a laser beam onto the film to form a surface consisting essentially of fused inorganic oxides which acts as a solder stop.
REFERENCES:
patent: 3405224 (1967-10-01), Yawata et al.
patent: 3801366 (1974-04-01), Lemelson
patent: 4457950 (1984-07-01), Fujita et al.
patent: 4554732 (1985-11-01), Sadlo et al.
patent: 4766268 (1988-08-01), Uggowitzer
patent: 4779339 (1988-10-01), Ohtani et al.
patent: 4832982 (1989-05-01), Mori et al.
patent: 4847003 (1989-07-01), Palanisamy
patent: 4859808 (1989-08-01), Jeter et al.
patent: 4931323 (1990-06-01), Manitt et al.
patent: 4959751 (1990-09-01), Hearn et al.
patent: 5004640 (1991-04-01), Nakatani et al.
patent: 5041901 (1991-08-01), Kitano et al.
patent: 5113239 (1992-05-01), Cini et al.
patent: 5178658 (1993-01-01), Tumminelli et al.
patent: 5230756 (1993-07-01), Kawasaki
patent: 5281684 (1994-01-01), Moore et al.
Myers et al, "Method of Fabricating Thick Film Solder Attach Pads for Fine Pitch Flip Chips", No. 316121 Research Disclosure Aug. 1990.
Keeler, "Lasers for High-Reliability Soldering", Electronic Packaging & Production, Soldering Technology, Oct. 1987, pp. 29-31.
Patent Abstracts of Japan vol. 8, No. 226 (E-272) Oct. 17, 1984 & JP-A-59 106 140 (Matsushita Denshi Kogyo) Jun. 19, 1984 *abstract*.
Patent Abstracts of Japan vol. 14, No. 537 (E-1006) Nov. 27, 1990 & JP-A-22 28 050 (Hitachi Ltd) Sep. 11, 1990 *abstract*.
Patent Abstracts of Japan vol. 14, No. 463 (E-988) Oct. 8, 1990 & JP-A-21 87 045 (Sharp Corp) Jul. 23, 1990 *abstract*.
European Search Report No. EP 92 20 2815 dated Jan. 13, 1993 corres. to USSN 07/783,468.
Annex to European Search Report No. EP 92 20 2815 dated Jan. 13, 1993.
Blanton James A.
Coapman Christine R.
Isenberg John K.
Myers Bruce A.
Brooks Cary W.
Delco Electronics Corp.
Navarre Mark A.
Padgett Marianne
LandOfFree
Electrical connector having energy-formed solder stops and metho does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electrical connector having energy-formed solder stops and metho, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrical connector having energy-formed solder stops and metho will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-63997