Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1991-10-28
1994-01-25
Picard, Leo P.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174259, 174260, 361807, 29827, 29830, H05K 100
Patent
active
052817725
ABSTRACT:
A method of forming solder stops on a thick film, comprising a conductive metal and an inorganic oxide, including the step of directing a laser beam onto the film to form a surface consisting essentially of fused inorganic oxides which acts as a solder stop.
REFERENCES:
patent: 3405224 (1967-10-01), Yawata et al.
patent: 4554732 (1985-11-01), Sadlo et al.
patent: 4766268 (1988-08-01), Uggowitzer
patent: 4779339 (1988-10-01), Ohtani et al.
patent: 4847003 (1989-07-01), Palanisamy
patent: 4859808 (1989-08-01), Jeter et al.
patent: 4931323 (1990-06-01), Manitt et al.
patent: 4959751 (1990-09-01), Hearn et al.
patent: 5004640 (1991-04-01), Nakatani et al.
patent: 5041901 (1991-08-01), Kitano et al.
patent: 5113239 (1992-05-01), Cini et al.
Myers et al, "Method of Fabricating Thick Film Solder Attach Pads for Fine Pitch Flip Chips", No. 316121 Research Disclosure Aug. 1990.
Keeler, "Lasers for High-Reliability Soldering", Electronic Packaging & Production, Soldering Technology, Oct. 1987, pp. 29-31.
Patent Abstracts of Japan vol. 8, No. 226 (E-272) Oct. 17, 1984 & JP-A-59 106 140 (Matsushita Denshi Kogyo) Jun. 19, 1984 *abstract*.
Patent Abstracts of Japan vol. 14, No. 537 (E-1006) Nov. 27, 1990 & JP-A-22 28 050 (Hitachi Ltd) Sep. 11, 1990 *abstract*.
Patent Abstracts of Japan vol. 14, No. 463 (E-988) Oct. 8, 1990 & JP-A-21 87 045 (Sharp Corp) Jul. 23, 1990 *abstract*.
European Search Report No. EP 92 20 2815 dated Jan. 13, 1993 corres. to U.S. Ser. No. 07/783,468.
Annex to European Search Report No. EP 92 20 2815 dated Jan. 13, 1993.
Blanton James A.
Coapman Christine R.
Isenberg John K.
Myers Bruce A.
Brooks Cary W.
Delco Electronics Corporation
Figlin Cheryl R.
Picard Leo P.
LandOfFree
Electrical connector having energy-formed solder stops and metho does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electrical connector having energy-formed solder stops and metho, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrical connector having energy-formed solder stops and metho will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-729399