4. Stock material or miscellaneous articles
  5. All metal or with adjacent metals
  6. Composite; i.e., plural, adjacent, spatially distinct metal...

Birendra N. Agarwala

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Dual damascene multi-level metallization

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Dual-damascene metallization interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Edge seal for a semiconductor device

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Etching processes for avoiding edge stress in semiconductor chip

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Method for providing electrically fusible links in copper interc

Semiconductor device manufacturing: process – Making device array and selectively interconnecting – Using structure alterable to nonconductive state
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Profile ID: LFUS-PAI-P-126875

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