4. Dynamic information storage or retrieval
  5. Specific detail of information handling portion of system
  6. Radiation beam modification of or by storage medium

Bernard Andre

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Method for low-temperature sealing of a cavity under vacuum...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate

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Micro-component packaging process and set of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Process for intentional deterioration of the contents of an...

Dynamic information storage or retrieval – Specific detail of information handling portion of system – Radiation beam modification of or by storage medium
Reexamination Certificate

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Process for packaging micro-components using a matrix

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Thin hafnium oxide film and method for depositing same

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
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Profile ID: LFUS-PAI-P-2284310

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