Process for packaging micro-components using a matrix

Details Process for packaging micro-components using a matrix Process for packaging micro-components using a matrix

2011-03-01

2011-03-01

Landau, Matthew C (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S125000, C438S126000, C438S127000, C257S684000, C257S687000, C257S704000, C257SE33056, C257SE33059, C257SE23127, C257SE21504

Reexamination Certificate

active

07897436

ABSTRACT:
A process for packaging a number of micro-components on the same substrate wafer, in which each micro-component is enclosed in a cavity. This process includes making a covering plate comprising a re-useable matrix, a polymer layer, and a metal layer; covering the wafer with the covering plate; applying a contact pressure equal to at least one bar on the covering plate and on the wafer; heating the metal layer during pressing until sealing is obtained, each cavity thus being provided with a sealing area and closed by metal layer; and dissolving the polymer to recover and recycle the matrix.

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