Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2011-08-16
2011-08-16
Roman, Angel (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S659000, C257S660000, C257S704000, C257SE23127, C257SE23128
Reexamination Certificate
active
07999366
ABSTRACT:
A process for packaging a plurality of micro-components made on the same substrate wafer, in which each micro-component is enclosed in a cavity. This process includes making a cover plate; depositing a metal layer on a face of the cover plate or on a face of the wafer; covering the wafer with the cover plate; applying a contact pressure equal to at least one bar onto the cover plate and onto the wafer; and heating the metal layer during pressing until a seal is obtained, each cavity thus being provided with a sealing area and being closed by a part of the cover plate and/or its metal layer.
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Andre Bernard
Bouche Guillaume
Sillon Nicolas
Graybeal Jackson
Jablonski Kevin D.
Jorgenson Lisa K.
Roman Angel
STMicroelectronics S.A.
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