4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Behrooz Mehr

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Ball grid array integrated circuit package

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Capacitor method and apparatus

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Reexamination Certificate

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Drop-in heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Patent

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Electronics package that has a substrate with an array of hollow

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Method of making a drop-in heat sink

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Profile ID: LFUS-PAI-P-696933

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