Drop-in heat sink

Details Drop-in heat sink Drop-in heat sink

1995-05-26

1996-06-25

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With heat sink embedded in encapsulant

257675, 257722, 361718, 361723, 165 803, H01L 2328, H01L 23495

Patent

active

055302955

ABSTRACT:
A heat sink incorporated into an electronic package. The package contains an integrated circuit enclosed by a dielectric housing. Coupled to the circuit is a lead frame which has a plurality of leads that extend from the outer edges of the housing. The heat sink has a bottom surface pressed against the lead frame and an opposite top surface that is exposed to the ambient. The heat sink also has a pair of oblique steps which engage the housing and insure that the sink does not become detached from the package.

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